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IPC 标 准 目 录
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电 子 组 装（Assembly）
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IPC-T-50F |
Terms
and Definition for Interconnecting and Packaging Electronic Circuits |
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IPC-S-100 |
Standards
and Specifications Manual |
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IPC-S-100 |
Test
Methods Manual |
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IPC/EIA J-STD-001C |
Requirements
for Soldered Electrical & Electronic Assemblies |
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IPC-HDBK-001 |
Handbook
and Guide to Supplement J-STD-001—Includes Amendment 1 |
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IPC-A-610C |
Acceptability
of Electronic Assemblies |
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IPC/WHMA-A-620 |
Requirements
and Acceptance for Cable and Wire Harness Assemblies |
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IPC/EIA
J-STD-012 |
Implementation
of Flip Chip and Chip Scale Technology |
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IPC-SM-784 |
Guidelines
for Chip-on-Board Technology Implementation |
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IPC/EIA
J-STD-026 |
Semiconductor
Design Standard for Flip Chip Applications |
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IPC/EIA
J-STD-028 |
Performance
Standard for Construction of Flip Chip and Chip Scale Bumps |
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J-STD-013 |
Implementation
of Ball Grid Array and Other High Density Technology |
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IPC-7095 |
Design
and Assembly Process Implementation for BGAs |
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IPC-MC-790 |
Guidelines
for Multichip Module Technology Utilization |
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IPC-M-108 |
Cleaning
Guides and Handbook Manual |
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IPC-CH-65A |
Guidelines
for Cleaning of Printed Boards & Assemblies |
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IPC-SA-61 |
Post
Solder Semi-aqueous Cleaning Handbook |
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IPC-AC-62A |
Aqueous
Post Solder Cleaning Handbook |
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IPC-9201 |
Surface
Insulation Resistance Handbook |
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IPC-M-109 |
Component
Handling Manual |
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IPC/JEDEC
J-STD-020B |
Moisture/Reflow
Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices |
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IPC/JEDEC
J-STD-033A |
Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount
Devices |
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IPC/JEDEC
J-STD-035 |
Acoustic
Microscopy for Non-Hermetic Encapsulated Electronic Components |
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IPC-M-103 |
Standards
for Surface Mount Assemblies Manual |
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IPC-M-104 |
Standards
for Printed Board Assembly Manual |
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IPC-SM-780 |
Component
Packaging and Interconnecting with Emphasis on Surface Mounting |
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IPC-SM-785 |
Guidelines
for Accelerated Reliability Testing of Surface Mount Attachments |
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IPC-7525 |
Stencil
Design Guidelines |
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IPC/EIA
J-STD-004 |
Requirements
for Soldering Fluxes-Includes Amendment 1 |
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IPC/EIA
J-STD-005 |
Requirements
for Soldering Pastes-Includes Amendment 1 |
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IPC/EIA
J-STD-006A |
Requirements
for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid
Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求 |
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IPC-SM-817 |
General
Requirements for Dielectric Surface Mounting Adhesives |
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IPC-CA-821 |
General
Requirements for Thermally Conductive Adhesives |
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IPC-3406 |
Guidelines
for Electrically Conductive Surface Mount Adhesives |
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IPC-3408 |
General
Requirements for Anisotropically Conductive Adhesives Films |
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IPC-CC-830B |
Qualification
and Performance of Electrical Insulating Compound for Printed Wiring
Assemblies |
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IPC-SM-840C |
Qualification
and Performance of Permanent Solder Mask - Includes Amendment 1 |
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IPC-7530 |
Guidelines
for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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IPC-9701 |
Performance
Test Methods and Qualification Requirements for Surface Mount Solder
Attachments |
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IPC-S-816 |
SMT
Process Guideline & Checklist |
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IPC-CM-770D |
Component
Mounting Guidelines for Printed Boards |
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IPC-7912 |
Calculation
of DPMO & Manufacturing Indices for Printed Board Assemblies |
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IPC-9261 |
In-Process
DPMO and Estimated Yield for PWAs |
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IPC-9501 |
PWB
Assembly Process Simulation for Evaluation of Electronic Components
电子元件的印制板组装过程模拟评价 |
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IPC-9502 |
PWB
Assembly Soldering Process Guideline for Electronic Components |
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IPC-9503 |
Moisture
Sensitivity Classification for Non-IC Components |
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IPC-9504 |
Assembly
Process Simulation for Evaluation of Non-IC Components (Preconditioning
Non-IC Components) |
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IPC-7711/21
7711 & 7721 |
Package
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IPC-7711 |
Rework
of Electronic Assemblies |
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IPC-7721 |
Repair
and Modification of Printed Boards and Electronic Assemblies |
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IPC/EIA
J-STD-002B |
Solderability
Tests for Component Leads, Terminations, Lugs, Terminals and Wires
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IPC/EIA
J-STD-003 |
Solderability
Tests for Printed Boards |
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设 计（Design） |
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IPC-M-106 |
Technology
Reference for Design Manual |
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IPC-2220 |
Design
Standard Series |
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IPC-2221A |
Generic
Standard on Printed Board Design |
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IPC-2222 |
Sectional
Standard on Rigid Organic Printed Boards |
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IPC-2223 |
Sectional
Design Standard for Flexible Printed Boards |
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IPC-2224 |
Sectional
Standard of Design of PWB for PC Card |
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IPC-2225 |
Sectional
Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
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IPC-SM-782A |
Surface
Mount Design and Land Pattern Standard--Includes Amendments 1 & 2 |
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IPC-D-859 |
Design
Standard for Thick Film Multilayer Hybrid Circuits |
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IPC-1902 |
IPC/IEC
Grid Systems for Printed Circuits IPC/IEC印制电路网格体系 |
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IPC-2615 |
Printed
Board Dimensions and Tolerances |
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IPC-D-322 |
Guidelines
for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes |
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IPC-2531 |
Standard
Recipe File Format Specification |
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IPC-2541 |
Generic
Requirements for Electronics Manufacturing Shop Floor Equipment Communication |
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IPC-2546 |
Sectional
Requirements for Specific Printed Circuit Board Assembly Equipment |
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IPC-2571 |
Generic
Requirements for Electronics Manufacturing Supply Chain Communication -
Product Data eXchange (PDX) |
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IPC-2511A |
Generic
Requirements for Implementation of Product Manufacturing Description Data
& Transfer Methodology |
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IPC-D-356B |
Bare
Board Electrical Test Data Format |
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印 制 电 路 板 |
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IPC-M-105 |
Rigid
Printed Board Manual |
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IPC-D-325A |
Documentation
Requirements for Printed Boards 印制板设计文件图册要求 |
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IPC-PE-740A |
Troubleshooting
for Printed Board Manufacture and Assembly |
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IPC-6010 Series |
IPC-6010
Qualification and Performance Series |
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IPC-6011 |
Generic
Performance Specification for Printed Boards |
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IPC-6013-K |
Qualification
& Performance Specification for Flexible Printed Boards (Includes
Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） |
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IPC-6016 |
Qualification
& Performance Specification for High Density Interconnect (HDI) Layers or
Boards |
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IPC-6012A-AM |
Qualification
and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1) |
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IPC-6018A |
Microwave
End Product Board Inspection and Tech |
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IPC-6015 |
Qualification
& Performance Specification for Organic Multichip Module (MCM-L) Mounting
and Interconnections |
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IPC-A-600F |
Acceptability
of Printed Boards |
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IPC-HM-860 |
Specification
for Multilayer Hybrid Circuits |
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IPC-TF-870 |
Qualification
and Performance of Polymer Thick Film Printed Boards |
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IPC-ML-960 |
Qualification
and Performance Specification for Mass Lamination Panels for Multilayer
printed Boards |
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IPC-DR-572 |
Drilling
Guidelines for Printed Boards |
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IPC-NC-349 |
Computer
Numerical Control Formatting for Drillers and Routers |
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IPC-SM-839 |
Pre
& Post Solder Mask Application Cleaning Guidelines |
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IPC/JPCA-4104 |
Specification
for High Density Interconnect (HDI) and Microvia Materials |
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IPC-6016 |
Qualification
& Performance Specification for High Density Interconnect (HDI) Layers or
Boards |
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IPC/JPCA-6801 |
IPC/JPCA
Terms & Definitions, Test Methods, and Design Examples for Build-Up/High
Density Interconnection |
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IPC-DD-135 |
Qualification
Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Modules |
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IPC-4103 |
Specification
for Base Materials for High Speed/High Frequency Applications |
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IPC-6018A |
Microwave
End Product Board Inspection and Test |
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IPC-D-317A |
Design
Guidelines for Electronic Packaging Utilizing High Speed Techniques |
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IPC-M-102 |
Flexible
Circuits Compendium |
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IPC-4202 |
Flexible
Base Dielectrics for Use in Flexible Printed Circuitry |
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IPC-4203 |
Adhesive
Coated Dielectric Films for Use as Cover Sheets for Flexible Printed
Circuitry and Flexible Adhesive Bonding Films |
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IPC-4204 |
Flexible
Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry |
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IPC-6013-K |
Qualification
& Performance Specification for Flexible Printed Boards & Amendment 1
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IPC/JPCA-6202 |
IPC/JPCA
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring
Boards |
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IPC-FC-234 |
Composite
Metallic Materials Specification for Printed Wiring Boards |
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IPC-M-107 |
Standards
for Printed Board Materials Manual 印制板材料标准手册 |
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IPC-4101A |
Specifications
for Base Materials for Rigid and Multilayer Printed Boards |
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IPC-4121 |
Guidelines
for Selecting Core Construction for Multilayer Printed Wiring Board
Applications 多层印制板用芯板结构选择导则 |
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IPC-4562 |
Metal
Foil for Printed Wiring Applications |
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IPC-CF-148A |
Resin
Coated Metal for Printed Boards |
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IPC-CF-152B |
Composite
Metallic Materials Specification for Printed Wiring Boards |
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IPC-4412 |
Specification
for Finished Fabric Woven from ”E” Glass for Printed Boards |
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IPC-4130 |
Specification
& Characterization Methods for Nonwoven "E" Glass Materials |
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IPC-4110 |
Specification
and Characterization Methods for Nonwoven Cellulose Based Paper for Printed
Boards |
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IPC-4411-K |
Specification
and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with
Amendment 1 |
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IPC-4411-AM1 |
Specification
and Characterization Methods for Non-Woven Para-Aramid Reinforcement,
Amendment 1 |
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IPC-SG-141 |
Specification
for Finished Fabric Woven from "S" Glass for Printed Boards |
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IPC-A-142 |
Specification
for Finished Fabric Woven from Aramid for Printed Boards |
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IPC-QF-143 |
Specification
for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards |
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IPC-2524 |
PWB
Fabrication Data Quality Rating System |
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IPC-9191 |
General
Guidelines for Implementation of Statistical Process Control (SPC) |
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IPC-9252 |
Guidelines
and Requirements for Electrical Testing of Unpopulated Printed Boards |
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IPC-MS-810 |
Guidelines
for High Volume Microsection |
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IPC-QL-653A |
Certification
of Facilities that Inspect/Test Printed Boards, Components & Materials |
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IPC-TR-486 |
Round
Robin Study to Correlate IST & Microsectioning Evaluations for
Inner-Layer Separation |
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