导线（通道）：conduction (track)
长方形焊盘：oblong pad
子弹形盘：bullet pad
泪滴盘：teardrop pad
雪人盘：snowman pad
v形盘：v-shaped pad
环形盘：annular pad
非圆形盘：non-circular pad
隔离盘：isolation pad
非功能连接盘：monfunctional pad
偏置连接盘：offset land
导线（体）宽度：conductor width
腹（背）裸盘：back-bard land
盘址：anchoring spaur
连接盘图形：land pattern
连接盘网格阵列：land grid array
孔环：annular ring
元件孔：component hole
安装孔：mounting hole
支撑孔：supported hole
非支撑孔：unsupported hole
导通孔：via
导线距离：conductor spacing
镀通孔：plated through hole (pth)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意层内部导通孔：any layer inner via hole (alivh)
全部钻孔：all drilled hole
定位孔：toaling hole
无连接盘孔：landless hole
中间孔：interstitial hole
导线层：conductor layer
无连接盘导通孔：landless via hole
引导孔：pilot hole
端接全隙孔：terminal clearomee hole
准表面间镀覆孔：quasi-interfacing plated-through hole
准尺寸孔：dimensioned hole
在连接盘中导通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔图：hole pattern
钻孔图：drill drawing
导线宽度/间距：conductor line/space
装配图：assembly drawing
印制板组装图：printed board assembly drawing
参考基准：datum referance
基准尺寸：reference dimension
参考尺寸：reaerence dimension
直接量定尺寸：direct dimensioning
基准图：datum feature
基准边：reference edge
导线设计距离：design space of conductor
第一导线层：conductor layer no.1
导线设计宽度：design width of conductor
中心距：center to center spacing
线宽/间距：conductor width/space
节距：pitch
精细节距：fine pitch
层：layer
层间距：layer-to-layer spacing
边距：edge spacing
外形线：trim line
截面积：crossection area
圆形盘：round pad
真实值表测量：truth table test
准确位置：true position tolerance
精确位置：accuracy
精确位置误差：cumulative tolerance
精确度：accuracy
累积误差：cumulative tolerance
焊垫：footprint
外层：external layer
内层：internal layer
接地层：ground plane
方形盘：square pad
接地层隔离：ground plane clearance
电压层：voltage plane
电源层隔离：voltage plane clearance
电源层：power plane, bus plane
导通网络：basic grid
导通网格：track grid
导通孔网格：via grid
连通盘网格：pad (land) grid
定位偏差：positional tolerance
对准靶标：bornb sight
菱形盘：diamond pad
梳状图形：comb pattern
对准标记：register mark
散热层：heat sink plane
